X-ray Metrology

The functional units of semiconductor and compound semiconductor devices shrink in size and thickness from generation to generation. In addition, the structures of the devices become increasingly complex – and the process more and more expensive. Thus, the demand for reliable analytics such as X-ray metrology for process development and at-line or in-line quality control increases permanently.

Why X-ray metrology? First, X-ray metrology is a non-contact and non-destructive method of probing the nanometric scale, which provides various essential parameters without the need to use a reference. Second, the method is known and accepted for many years within scientific, research and development communities for its accuracy and reliability. In many cases just one quick measurement is required to determine sample parameters with a spatial resolution better down to 50 μm².

The parameters of interests are: layer thickness, roughness, density, and chemical composition, lattice spacing, gradients, mismatches, and degree of relaxation.

Bruker AXS offers several solutions ranging from complete automated Fab tools for Front End of the Line (FEOL) and Back End of the Line (BEOL) to state of the art laboratory R&D tools.